SI Class Schedule


Signal Integrity & High Speed Methodology

 October 13 - 15
Finland

October 20 - 22
Singapore

October 27 - 29
India

November 10 - 12
Holland

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Fast Edges has many different classes available all over the world so contact us






Signal Integrity and High Speed Methodology

Course Description 

We offer classes from the beginner to the advanced user. One, two, and three day classes. Public or private classes at your location. Have presented classes for over 10 years with excellent real world examples. No advanced math is required only general engineering principles. Fast Edges has taught over 5,000 engineers worldwide - from the USA to Brazil to South Korea to Japan to Europe.  

This class will allow you to become familiar with signal integrity analysis at the board level. The lecture's modules address transmission lines and their effects on digital circuitry and printed circuit boards. The course will present detailed examples from real-world designs to demonstrate the necessity of understanding signal integrity issues and applying sound signal integrity principles to your PCB Design 

With this course you will gain a better understanding of the following:

• Transmission lines and their effect on digital circuitry
• Printed circuit boards: drivers, receivers, Zo, Zdiff, stackup
• Quality board designs
• Termination, topology, timing, parasitics, etc
• Crosstalk: understanding and preventing
• Differential pair: termination, routing, timing, EMI
• Clock distribution, high speed busses, groundbounce
• Reference planes: ground, power, return currents, splits
• S parameters
• High speed layout: vias, connectors, capacitors, losses
• Testing issues: equipment, probes, test points
• Models: SPICE, IBIS, drivers, receivers, simulators and accuracy
• PCB simulations that detect signal integrity problems before fabrication
• Vias: reference changes, good via design

Audience

• Digital Design Engineers
• ECAD Designers with some high speed experience
• Technicians with High Speed experience
• Those who would like to further their knowledge on Printed Circuit Board Signal Integrity issues.
• No advanced math is needed
 

Signal Integrity and High Speed Methodology

3 - 5 day class syllabus

What is a transmission line
          What causes transmission lines
          What do they do to digital circuitry
          What can be done to avoid transmission lines

Transmission line effects
          Undershoot
          Overshoot
          Ringback
          Monotonicity
          Crosstalk
          Timing
          Overshoot and undershoot can destroy boards

Reference return current
          Where does the return current flow
          How does it flow to the reference plane

Printed circuit boards
          Stackup
          How to make controlled Zo
          Controlled Zo or controlled distance
          Multiple sources

Drivers, receivers, Zo
          How strong should the drivers be
          How fast should the drivers be
          How many receivers can I have
          What should the Zo be
          Incident vs reflected wave switching

Board interconnect delay
          How is it different than system delay
          Need to include interconnect delay in timing
          How is it calculated
          Receiver input C
          Driver output Rs
          PCB Zo
          Reflected vs incident wave switching

Termination
          When is it needed
          Required to stop undershoot and overshoot
          Driver and topology dependent
          Placement and stub length
          Parallel
          Series
          AC parallel
          Zo matching
          Driver Rs matching
          Diode

Topologies
          When are topologies important
          How do topologies affect signal integrity
          How do topologies affect timing
          Driver and termination dependent
          Stub length
          Short Tee
          Long Tee
          Star
          Daisy chain

Parasitics
          L's, C's, and R's
          How do they affect the timing
          How do they affect signal integrity
          How to minimize their effects
          How capacitance affects Zo
          Capacitive loading on transmission lines

Differential pair
          Why are they important
          Noise and EMI
          Layout issues
          Zdiff, Zcomm, Zeven, & Zodd
          Controlling Zdiff
          Side to side vs broadside
          Coupling issues
          Weak vs strong coupling
          Zdiff changes
          Skew affects on timing
          Skew affects on signal integrity
          Terminations

Crosstalk
          Very important with dense boards
          What causes crosstalk
          How can crosstalk be minimized
          What factors can be controlled
          Faster silicon then more crosstalk
          Routing densities
          What needs to be done by layout engineers
          Effects on timing
          Microstrip vs stripline
          Same layer vs dual stripline

Groundbounce - SSN
          What causes groundbounce
          What does it do to driver voltage levels
          What does it do to receiver voltage levels
          How can I test for it
          How can I stop it
          Problems with FPGAs and ASICs
          Number of outputs switching possible

Bypass capacitors
          What physical size
          ESL & ESR
          Package vs inductance
          Placement
          PCB electrical mounting
          Loop inductance

Reference planes
          Perforation
          Crossing splits
          Consistency in designs
          Layer changes
          Vias and references
          Board to board consistency
          Controls routing
          Controls stackup

Connectors
          Controlled Zo
          Geometry
          Pinouts
          Reference consistency
          Coupling

Vias & plated thru holes
          Zo changes
          Reference changes
          Stub lengths
          When are they important
          How to avoid vias issues
          Blind & buried vias
          Dimension affects on parasitics
          Pads, antipads, hole diameter

S Parameters
          Frequency dependent descriptors
          Good for gigahertz designs
          S21 - Insertion loss or interconnect loss for SI
          Includes discontinuities, connectors, packages
          2 & 4 port networks
          SnP files
          VNA

Quality board designs
          What need to done to make quality boards
          What tools are needed to make quality boards
          Signal integrity issues must be included

AC losses
          Skin effect
          Dielectric loss
          Microstrip vs stripline
          Noise margins with differential pair
          Pre-emphasis & equalization

Layout issues
          Boards are becoming more difficult to layout
          What issues are important in today’s fast boards for layout
          PCBs are now part of the design

Testing issues
          Faster boards are harder to test
          How do you test them
          What equipment do you need
          How fast does the equipment need to be
          Many older methods no longer work

IBIS models
          Drivers
          Receivers
          Simulators
          Accuracy

Examples (very detailed):

From paper at European High Speed Symposium in Munich:

Crosstalk
          Forward & reverse
          Far-end & near-end
          Microstrip vs stripline
          Driver & receiver direction affects
          Parallel tracking
          Spacing
          Driver strength & speed
          Termination affects
          Noise margin
          Board layout
          Controlling and reducing
          How crosstalk changes timing
          Pattern dependent
          Problems with multiple vendors

From paper at User2User High Speed Seminar in San Jose:
          Split plane crossings
          Reference return current
          Signals crossing reference splits
          Microstrip vs Stripline
          Size of split
          Plane to plane spacing
          Timing
          Signal integrity
          Multiple signals crossing together
          How do splits affect crosstalk
          Vias and reference changes
          Board to board reference changes
          System considerations

 

 



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